Solar wafer makers accelerate switch to diamond wire saws

Diamond wire saw with monocrystalline silicon ingot
Being standard for monocrystalline wafers, diamond wire saws now find their way into multicrystalline wafering – Image: Meyer Burger

Many Chinese producers of multicrystalline solar wafers have accelerated their transition to lower-cost diamond wire slicing and will complete the switch by the end of 2017, Digitimes reports.

Along the same lines, REC Solar, a vertically integrated manufacturer of multicrystalline modules with a capacity of 1.4 GW in Singapore, has ordered diamond wire saws from equipment supplier Meyer Burger, with delivery scheduled for the third quarter of 2017.

NEW: Get Your In-depth Report – The Polysilicon Market Outlook 2027

  • Benefit from 102 pages full of rich data, in-depth analyses and detailed forecasts on the polysilicon, solar and semiconductor industries
  • Learn all about the latest developments of polysilicon manufacturing technologies (Siemens process, fluidized bed reactor, upgraded silicon kerf loss from wafer sawing)
  • Obtain comprehensive data on production volumes and capacities of 45 solar-grade and electronic-grade polysilicon plants from 2020 through 2027
  • Gain insight into decisive market trends, based on four sophisticated scenarios of supply and demand through 2027
  • Get valuable guidance with cash cost data on 30 solar-grade polysilicon plants and spot price forecasts through 2027

Go to the Report

Learn all about the polysilicon market

Go back

Comments

Add a comment

Back to Polysilicon News